NDLI: Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process

Content Provider	IEEE Xplore Digital Library
Author	Tang, Y. Zhou, B. Huang, J. H. Wu, Z. Z. Li, G. Y.
Copyright Year	2014
Description	Author affiliation: Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory, Guangzhou, China (Zhou, B.) \|\| School of Electronic and Information Engineering, South China University of Technology, Guangzhou, China (Tang, Y.; Huang, J. H.; Wu, Z. Z.; Li, G. Y.)
Abstract	The effect of nano-Bi particles on the growth of intermetallic compound (IMC) between Sn-3.0Ag-0.5Cu-xBi (x=0.0, 0.8, 1.5, 2.5, 3.5, and 4.5 wt.%) solder and Cu substrate during aging process at temperatures of 120, 150, and 190°C has been investigated in this study. Scanning electron microscopy (SEM) was used to observe the microstructural evolution of the solder joints and measure the thickness of IMC layer. Energy dispersive X-ray (EDX) was adopted to identify the composite of the IMC phase. The activation energies and growth rates of the IMC layer were determined. Results show that adding nano-Bi into Sn-3.0Ag-0.5Cu solder can increase activation energy and thus reduce the atomic diffusion rate, so as to suppress the excessive growth of the IMC layer. The solder joints containing about 0.8wt.% nano-Bi has the highest activation energy and the lowest growth rate. SEM images reveal that with an increase in nano-Bi to 0.8 wt.%, the number of small particles precipitated along grain boundary reaches maximum. Based on the observation of the microstructural evolution of the solder joints, a grain boundary pinning mechanism for inhibition of the IMC grow due to nano-Bi addition is proposed.
Starting Page	141
Ending Page	144
File Size	645540
Page Count	4
File Format	PDF
ISBN	9781479938605
DOI	10.1109/ISAF.2014.6917832
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Aging Grain boundaries Intermetallic Substrates Compounds Bismuth activation energy lead-free solder nano-dopant intermetallic growth
Content Type	Text
Resource Type	Article

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