NDLI: Effect of Cu/Al substrate thickness on the deformation and fatigue Life of Bumps Array

Content Provider	IEEE Xplore Digital Library
Author	Chen, Shijie Wu, Fengshun Xia, Weisheng Liu, Hui Xiao, Ming Huang, Lin
Copyright Year	2014
Description	Author affiliation: College of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China (Chen, Shijie; Wu, Fengshun; Xia, Weisheng; Liu, Hui; Xiao, Ming; Huang, Lin)
Abstract	Since 3D-TSV technology has been more and more popular aiming at the demand of lightweight and multi-functions of electronic devices in recent years, the μ-C4 bumps with smaller size which interconnect the stacked die will suffer more serious operating stress, and even one of the thousands bumps fails, the device will fail. Hence, it is meaningful to study the reliability of smaller size and higher density bumps. In this paper, influence of the Cu/Al substrate thickness on the bumps stress, strain and fatigue life during thermal cycle is studied by finite element analysis (FEA), since Cu/Al have large coefficient of thermal expansion (CTE) and can induce large stress and strain on bumps. In this model, the bumps diameter and height are 15 μm, interval spacing is 100 μm, and selected substrate thicknesses are 1 mm, 2 mm and 4 mm, respectively. After 10 thermal cycles, it is observed that compared with the Cu substrate with different thickness, there is an approximate linear relationship between the sum displacement and substrate thickness, while the stress and strain have only little change. And this is same to Al substrate with different thickness. Compared Cu with Al substrate effect on bumps with thickness of 1mm, 2 mm and 4 mm, respectively, the ratio of the sum displacement and $$α of Al and Cu have approximate value, 1.35 and 1.43, respectively. Furthermore, the maximum effective stress nodes of bumps on two different substrates locate at different places: on the Al substrate, the max stress points locate on the edge of the bump-Al substrate and the value is 66.3 MPa; on the Cu substrate, the points locate on the edge of the bump-Si with the average value of 64.1 MPa.
Starting Page	1035
Ending Page	1039
File Size	818249
Page Count	5
File Format	PDF
ISBN	9781479938605
DOI	10.1109/ISAF.2014.6918032
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Substrates Strain Stress Fatigue Plastics Thermal stresses Silicon fatigue life bumps array thermal cycle analysis substrate thickness finite element analysis
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Effect of Cu/Al substrate thickness on the deformation and fatigue Life of Bumps Array

Effect of interface structure on fatigue life under thermal cycle with SAC305 solder joints

Thermal stress and deformation depend on thickness of CCD composite dielectrics

Influence of geometry of microbump interconnects on thermal stress and fatigue life of interconnects in copper filled through silicon via structure

Thermo-elasto-plastic Stress and Strain Analysis and Life Prediction of Gas Turbine Blade

Thermal fatigue life analysis and forecast of PBGA solder joints on the flexible PCB based on finite element analysis

Thermal fatigue reliability design of solder bumps in TSV interposer package based on finite element analysis

The analysis on thermal fatigue life of LCCC package based on strain fatigue model and FEM

Effect of Residual Stress or Plastic Deformation History on Fatigue Life Simulation of Pipeline Dents

Effect of Cu/Al substrate thickness on the deformation and fatigue Life of Bumps Array

Similar Documents

Effect of Cu/Al substrate thickness on the deformation and fatigue Life of Bumps Array

Effect of interface structure on fatigue life under thermal cycle with SAC305 solder joints

Thermal stress and deformation depend on thickness of CCD composite dielectrics

Influence of geometry of microbump interconnects on thermal stress and fatigue life of interconnects in copper filled through silicon via structure

Thermo-elasto-plastic Stress and Strain Analysis and Life Prediction of Gas Turbine Blade

Thermal fatigue life analysis and forecast of PBGA solder joints on the flexible PCB based on finite element analysis

Thermal fatigue reliability design of solder bumps in TSV interposer package based on finite element analysis

The analysis on thermal fatigue life of LCCC package based on strain fatigue model and FEM

Effect of Residual Stress or Plastic Deformation History on Fatigue Life Simulation of Pipeline Dents

Effect of Cu/Al substrate thickness on the deformation and fatigue Life of Bumps Array