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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Li, Gang Yu, Shuhui Sun, Rong |
| Copyright Year | 2014 |
| Description | Author affiliation: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China (Li, Gang; Yu, Shuhui; Sun, Rong) |
| Abstract | In this study, we report the large-scale fabrication of Cu@SiO2 nanoparticles with core-shell structure using a modified Stöber method. The obtained nanoparticles had an average particle size of 300 nm with SiO2 shell about 20 nm and exhibited excellent oxidation resistance and thermal stability in air atmosphere. PVDF based nanocomposites filled with pure Cu and Cu@SiO2 nanoparticles have been prepared by hot press method and their dielectric behavior was investigated. Compared with the Cu/PVDF composite, no typical percolation effect was observed in the Cu@SiO2/PVDF composite and when the content of Cu@SiO2 filler reached 20 vol %, the composite exhibited a high dielectric constant of 100 while maintained a low loss value of 0.1 at 1 kHz. Based on their excellent dielectric properties, core-shell Cu@SiO2 NPs are expected to be ideal fillers to develop polymer-based composites with high dielectric constant and low dielectric loss. |
| Starting Page | 384 |
| Ending Page | 387 |
| File Size | 489051 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479938605 |
| DOI | 10.1109/ISAF.2014.6917887 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-05-12 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Nanoparticles Dielectric constant Nanocomposites Polymers Silicon compounds Dielectric losses percolation effect oxidation-resistant Cu@SiO |
| Content Type | Text |
| Resource Type | Article |
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