NDLI: A Study on the Thermal Fatigue Behavior of Solder Joints Under Power Cycling Conditions

Content Provider	IEEE Xplore Digital Library
Author	Se Young Yang Ilho Kim Soon-Bok Lee
Copyright Year	1999
Abstract	Failure mechanisms exposed by environmental accelerating testing methods such as thermal cycling or thermal shock test, may differ from those at service operating conditions. While the device is heated up or cooled down evenly on its external surface during environmental testing, real operating powered devices experience temperature gradients caused by internal local heating, components' different heat dissipation capability, and ambient temperature variation, etc. In this study, a power cycling technique is introduced to better approximate the field operating conditions so as to activate the field failure modes. Power cycling thermal fatigue test is performed with different ball grid array solder joints, that is, lead contained [Sn/37 Pb (SP)] and lead free [Sn/4.0Ag/0.5 Cu (SAC)], and the result is compared. In order to account for the thermal fatigue life behavior discrepancy for different solder joint composition, real time Moire interferometry is applied to measure the global/local thermo-mechanical behavior during power cycling excursion. Effective damage parameter, the total average shear strain, is extracted from the experiment and applied to account for the difference in fatigue life result of two different solders. In addition, amount of experimentally measured total average shear strain is mutually verified with finite element method analysis. It is clear that total average shear strain of a solder joint can be an effective damage parameter to predict thermo-mechanical fatigue life. A physical mechanism in terms of thermal material property of solder joints' is proposed to offer some thoughts to abnormal shear strain behavior that leads to discrepancies in fatigue life of two solders. An importance of power cycling testing method is emphasized for certain package designs.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	3
Ending Page	12
Page Count	10
File Size	3264726
File Format	PDF
ISSN	15213331
Volume Number	31
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-03-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fatigue Soldering Testing Lead Capacitive sensors Temperature Tin Thermomechanical processes Strain measurement Failure analysis thermal fatigue life Lead free solder joint moirÉ interferometery power cycling shear strain
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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