NDLI: The study of novel metal/composite thermal interface materials for chip testing

Content Provider	IEEE Xplore Digital Library
Author	Shen, Wang Xionghui, Cai Guang, Chen Fengshun, Wu Weishen, Xia Wenbo, Zhu Ruhua, Liu Yi, Zhang
Copyright Year	2014
Description	Author affiliation: College of Material Science and Technology Huazhong University of Science and Technology Wuhan, China (Shen, Wang; Xionghui, Cai; Guang, Chen; Fengshun, Wu; Weishen, Xia; Wenbo, Zhu) \|\| Research Department of Test Engineering Intel (Chengdu) Products Co., Ltd, Chengdu, China (Ruhua, Liu; Yi, Zhang)
Abstract	Thermal interface materials (TIMs) which consist of metal foil and soft cushion are used in the process of chip processor platform validation (PPV) process, and some defects, such as the stains caused by debris peeled off from TIMs due to stress concentration, were found on the surface of the chips and they had an hazardous influence in the testing process. As well as that, the thermal resistance of TIMs is also a crucial issue that deserves to be further studied. To solve these problems, not only the metal layers in TIMs with less contamination are needed to be chosen, but also TIMs with higher thermal conductivity are needed to be developed. In this paper, Finite element method (FEM) was employed to evaluate the stress concentration area, where the debris were normally observed. And different kinds of composite were fabricated in a mould and tested in the PPV detection system. Simulation results showed that the stress concentration area is located at the contacted position between Al foil and chip, where the maximum stress and strain is $3.03×10^{7}Pa$ and $9.379×10^{−3}$ respectively. In addition, four different kinds of TIMs were fabricated and tested in the PPV system. It was found that the copper/ soft cushion is the potential TIMs.
Starting Page	352
Ending Page	355
File Size	454914
Page Count	4
File Format	PDF
ISBN	9781479938605
DOI	10.1109/ISAF.2014.6917880
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal conductivity Materials Nickel Conductivity Finite element analysis Stress finite element method thermal interface materials (TIMs) processor platform validation (PPV) stain thermal conductivity
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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