NDLI: Is thermal management outside the package enough for higher LED reliability?

Content Provider	IEEE Xplore Digital Library
Author	Chen, Qi Chen, Quan Hu, Run Luo, Xiaobing
Copyright Year	2014
Description	Author affiliation: School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China (Chen, Qi; Chen, Quan; Hu, Run; Luo, Xiaobing)
Abstract	Thermal management has always been crucial for the improving of LED reliability. Most researches focus on the thermal management outside the package like fin optimization, microchannel, microjet cooling, but few refer to the thermal management inside the package. In this paper, a contrast experiment was carried out by an online testing method to explore the LED's optical degradation under conditions with/without thermal management inside the LED package. Results show that different LED degradation characteristics appear in the experiment and the sample without package-inside thermal management exhibits carbonization phenomenon. Thermal management inside the package should be further reinforced to enhance the reliability of LED package.
Starting Page	1068
Ending Page	1070
File Size	412335
Page Count	3
File Format	PDF
ISBN	9781479938605
DOI	10.1109/ISAF.2014.6918039
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Light emitting diodes Thermal management Reliability Degradation Phosphors Testing Electronic packaging thermal management reliability light-emitting diode thermal management online testing method
Content Type	Text
Resource Type	Article

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