NDLI: Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects

Content Provider	IEEE Xplore Digital Library
Author	Huang, Mingliang Zhang, Fei Yang, Fan Zhao, Ning
Copyright Year	2014
Description	Author affiliation: Laboratory of Electronic Packaging Materials, School of Materials Science & Engineering, Dalian University of Technology, Dalian, China 116024 (Huang, Mingliang; Zhang, Fei; Yang, Fan; Zhao, Ning)
Abstract	The effect of electromigration (EM) on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects was investigated under a current density of $5×10^{3}$ $A/cm^{2}$ at 150 °C. After aging and EM, the thickness of interfacial IMCs increased. The IMC layer at the cathode side was thicker than that at the anode side for the samples after EM. Compared with the as-soldered interconnects, the tensile strength of those after both aging and EM significantly decreased. Solder joints undergoing EM deteriorated more severely and their strength decreased more than the aging cases. As for the as-soldered samples, fracture occurred at the IMC/solder interface, while with increasing aging time, the fracture position changed from at the interface to in the bulk solder. With increasing EM time, the tensile fracture tended to occur at the cathode interface, since voids formed at the cathode side after EM.
Starting Page	1190
Ending Page	1193
File Size	1402240
Page Count	4
File Format	PDF
ISBN	9781479938605
DOI	10.1109/ISAF.2014.6918065
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Aging Zinc Cathodes Electromigration Anodes Soldering Electronics packaging fracture Cu/Sn-9Zn/Cu interconnect electromigration tensile strength intermetallic compound
Content Type	Text
Resource Type	Article

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