NDLI: Effect of interfacial reaction on tin whisker formation of Sn/Ni films deposited on copper lead-frame

Content Provider	IEEE Xplore Digital Library
Author	Liu, Ting Ding, Dongyan Hu, Yu Gong, Yihua
Copyright Year	2014
Description	Author affiliation: Materials Quality & Coating, Corporate Technology, Siemens Ltd., Shanghai, China (Hu, Yu; Gong, Yihua) \|\| Institute of Microelectronic Materials & Technology, School of Materials Science & Engineering, Shanghai Jiao Tong University, Shanghai, China (Liu, Ting; Ding, Dongyan)
Abstract	Ni film electroplated between matte tin film and Cu-based lead-frame was used as a diffusion barrier to prevent whisker formation on the tin surface through blocking the formation of Cu6Sn5 intermetallics. The interfacial microstructure of Sn/Ni and Sn/Cu which formed after reflow treatment and the following humidity/thermal testing were characterized by SEM and BSE. The testing results indicated that the reflow treatment helped to prevent tin whisker growth even after 10000 hours storage under 55°C/85% RH conditions. The intermetallic compounds (IMCs) formation due to the interface reaction between Ni barrier and the surface Sn film had significant influence on the mitigation of tin whiskers growth. The thickness evolution of IMCs at the interface indicated that Ni3Sn4 also served as a better diffusion barrier in Sn/Ni/Cu system than Cu6Sn5 did in Sn/Cu system and thus affected the internal stress state within the tin films. Accordingly, reflow treatment was recommended to suppress tin whisker growth to a great extent under thermal and humidity conditions.
Starting Page	1005
Ending Page	1009
File Size	1006553
Page Count	5
File Format	PDF
ISBN	9781479938605
DOI	10.1109/ISAF.2014.6918026
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Tin Nickel Films Lead Surface treatment Coatings Surface morphology intermetallic compound (IMC) reliability Sn whisker growth interfacial reaction reflow Ni barrier
Content Type	Text
Resource Type	Article

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