NDLI: Study on size effect and cross-interaction in Cu/Sn/Ni-P interconnects

Content Provider	IEEE Xplore Digital Library
Author	Huang, Mingliang Yang, Fan Zhao, Ning Liu, Xiaohua Wang, Jingyun
Copyright Year	2014
Description	Author affiliation: Laboratary of Electronic Packaging Materials, School of Materials Science & Engineering, Dalian University of Technology, Dalian, China 116024 (Huang, Mingliang; Yang, Fan; Zhao, Ning; Liu, Xiaohua; Wang, Jingyun)
Abstract	The continuous downsizing of solder interconnect will significantly affect the wetting reactions between solder balls and pads and the cross-interaction of opposite heterogeneous pads, which further affects the reliability of the interconnect. In the present work, Cu/Sn-3Ag-0.5Cu/Ni-P solder interconnects with ball diameters of 200, 300, 400 and 500 μm were reflow soldered to study the size effect and cross-interaction in the solder interconnects. It was found that (Cu, Ni)6Sn5 type intermetallic compounds (IMCs) formed on both Cu and Ni-P pads after soldering. The IMCs formed on the Cu pad had a scallop morphology and those formed on the Ni-P pad had a needle-type morphology. Meanwhile, cross-interaction occurred in all the Cu/Sn-3Ag-0.5Cu/Ni-P interconnects, i.e., the Ni atoms that diffused from the Ni-P side to the Cu side refined the (Cu, Ni)6Sn5 at the solder/Cu interface; also, the Cu atoms diffused from the Cu side to the Ni-P side prevented the transformation of IMCs from (Cu, Ni)6Sn5 to (Ni, Cu)3Sn4 at the solder/Ni-P interface. Moreover, the grain size of (Cu, Ni)6Sn5 in the 200 μm solder interconnect was larger than that in the 500 μm solder interconnect at Cu side.
Starting Page	429
Ending Page	432
File Size	1078223
Page Count	4
File Format	PDF
ISBN	9781479938605
DOI	10.1109/ISAF.2014.6917898
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Nickel Soldering Electronics packaging Morphology Numerical analysis Packaging Reliability Intermetallic compound Size effect Cross-interaction Cu/Sn-3Ag-0.5Cu/Ni-P interconnect Interfacial reaction
Content Type	Text
Resource Type	Article

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