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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Liwei Xu Mingliang Huang Quanbin Yao Yong Wang Binhao Lian |
| Copyright Year | 2015 |
| Description | Author affiliation: Sch. of Mater. Sci.&Eng., Dalian Univ. of Technol., Dalian, China (Liwei Xu; Mingliang Huang) || Beijing Microelectron. Technol. Inst., Beijing, China (Quanbin Yao; Yong Wang; Binhao Lian) |
| Abstract | The formation of interfacial intermetallic compound (IMC) and the mechanical properties of 95Pb-5Sn, 90Pb-10Sn and 85Pb-13Sn-2Cu (in wt.%) flip-chip solder joint with the Ti/Cu/Cu under bump metallization (UBM) after single and three times reflows were investigated. After reflow soldering, $Cu_{3}Sn$ IMC formed on the Cu under bump metallurgy (UBM) for all of the solder alloys. The thickness of the $Cu_{3}Sn$ IMC layers increased with increasing reflow times. The average IMC grain size of 85Pb-13Sn-2Cu/Cu was larger than those of 90Pb-10Sn/Cu and 95Pb-5Sn/Cu after same times reflows. Ball shear tests were carried out to evaluate the UBM solderability and the bonding quality of solder bumps after single reflow and three times reflows. The shear strength of 85Pb-13Sn-2Cu/Cu is higher than that of 90Pb-10Sn/Cu and 95Pb-5Sn/Cu after both one and three times reflows. The shear curves show that the solder joints occured significant plastic deformation and behaves a “ductile” fracture for all of the three solders. |
| Starting Page | 1279 |
| Ending Page | 1282 |
| File Size | 1020508 |
| Page Count | 4 |
| File Format | |
| e-ISBN | 9781467379991 |
| DOI | 10.1109/ICEPT.2015.7236813 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Reliability Annealing Flip-chip devices Soldering Packaging Intermetallic compound Sn-Pb-Cu Solder bump Interfacial reaction Mechanical property |
| Content Type | Text |
| Resource Type | Article |
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