NDLI: Formation of Pb/63Sn solder bumps using a solder droplet jetting method

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Formation of Pb/63Sn solder bumps using a solder droplet jetting method

Content Provider	Semantic Scholar
Author	Son, Ho-Young Nah, Jae-Woong Paik, Kyung-Wook
Copyright Year	2005
Abstract	Formation processes of Pb/63Sn solder droplets using a solder droplet jetting have not been sufficiently reported. Solving problems such as satellite droplets and position errors are very important for a uniform bump size and reliable flip-chip solder bump formation process. First, this paper presents the optimization of jet conditions of Pb/63Sn solder droplets and the formation process of Pb/63Sn solder bumps using a solder droplet jetting method. Second, interfacial reactions and mechanical strength of jetted Pb/63Sn solder bumps and electroless Ni-P/Au UBM joints have been investigated. Interfacial reactions have been investigated after the second solder reflow and aging, and results were compared with those of solder bumps formed by a solder screen-printing method. Third, jetted solder bumps with variable bump sizes have been demonstrated by a multiple jetting method and the control of waveform induced to a jet nozzle. Multiple droplets jetting method can control various height and size of solder bumps. Finally, real applications of jetted Pb/63Sn solder bumps have been successfully demonstrated on conventional DRAM chips and integrated passive devices (IPDs).
Starting Page	274
Ending Page	281
Page Count	8
File Format	PDF HTM / HTML
DOI	10.1109/tepm.2005.853068
Alternate Webpage(s)	http://koasas.kaist.ac.kr/bitstream/10203/1239/1/000231887300010.pdf
Alternate Webpage(s)	https://doi.org/10.1109/tepm.2005.853068
Volume Number	28
Journal	IEEE Transactions on Electronics Packaging Manufacturing
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article

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