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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yang, Y. Balaraju, J.N. Chen, Z. |
| Copyright Year | 2010 |
| Description | Author affiliation: Surface Engineering Division, National Aerospace Laboratories, Bangalore-560 017, India (Balaraju, J.N.) || School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798 (Yang, Y.; Chen, Z.) |
| Abstract | Electrolessly plated Ni-P has been extensively studied due to its high coating uniformity, selectivity and low coating stress. However, the use of lead-free solders accelerates interfacial reaction because they have higher melting points and higher Sn content than the conventional Pb-Sn solders. In this work, we developed a ternary electroless Ni-Sn-P (6∼7 wt.% of P and 15∼17 wt.% of Sn) alloy to be used as the soldering metallization. Besides having good solderability, the presence of Sn in electroless Ni-Sn-P changes the diffusion process during soldering reflow. Comparison was made with the results obtained from commercial binary Ni-P (6∼7 wt.% of P) metallization. The microstructure of the intermetallic compounds (IMCs) for Ni-P/Sn-3.5Ag and Ni-Sn-P/Sn-3.5Ag soldering reactions were investigated under different reflow durations with a reflow temperature of 260 °C. The diffusion mechanisms of solder reaction for both types of solder joints were discussed. In addition, it was found that the formation of microvoids is much more difficult in Ni-Sn-P solder joints than that in Ni-P solder joints, indicating Ni-Sn-P solder joints will have better mechanical properties. |
| Starting Page | 801 |
| Ending Page | 806 |
| File Size | 1261795 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424485604 |
| e-ISBN | 9781424485628 |
| e-ISBN | 9781424485611 |
| DOI | 10.1109/EPTC.2010.5702739 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-12-08 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Tin Nickel Soldering Metallization Copper Surface treatment Surface morphology |
| Content Type | Text |
| Resource Type | Article |
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