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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kejun Zeng Holdford, B. |
| Copyright Year | 2010 |
| Description | Author affiliation: SC Packaging, Texas Instruments Inc., 13020 TI Blvd., Dallas, 75243, USA (Kejun Zeng; Holdford, B.) |
| Abstract | NEMI recommended Sn3.9Ag0.6Cu to replace the eutectic SnPb solder, but solder joints of this alloy have poor performance in reliability tests of electronic packages, especially the board level drop test. In this paper, the effect of Cu content in solder is studied on the interfacial reliability of SnAgCu solder joints on the Ni/Au plated pads. After preconditioning (three reflows post package assembly), some solder balls fell off during routine handling of the packages. Cracking occurred between the IMC layers of (Cu,Ni)6Sn5 and Ni3Sn4. Formation of the dual IMC structure is explained from the perspective of interfacial equilibrium. It is suggested that to improve the drop performance of the packages that have Ni/Au plated pads the key is to avoid the formation of the layer-type of (Cu,Ni)6Sn5 at the interface. Approaches to do that are discussed. A rule for selecting solder alloy and surface materials on both sides of the joints is proposed for BGA packages. |
| Starting Page | 652 |
| Ending Page | 659 |
| File Size | 9302598 |
| Page Count | 8 |
| File Format | |
| ISBN | 9781424485604 |
| e-ISBN | 9781424485628 |
| e-ISBN | 9781424485611 |
| DOI | 10.1109/EPTC.2010.5702720 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-12-08 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Soldering Nickel Copper Surface cracks Crystals Gold |
| Content Type | Text |
| Resource Type | Article |
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