Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Pabo, E.F. Matthias, T. Lindner, P. Dragoi, V. Kettner, P. |
| Copyright Year | 2010 |
| Description | Author affiliation: EV Group, DI E. Thallner 1, 4782-St. Florian/Inn, Austria (Matthias, T.; Lindner, P.; Dragoi, V.; Kettner, P.) || EV Group Inc, 7700 South River Parkway, Tempe, AZ 85284, USA (Pabo, E.F.) |
| Abstract | Wafer to wafer bonding was an enabling technology for MEMS because it provided the needed protection for the devices by capping them at the wafer level allowing them to survive in the required operating environments such as the automotive environment. The two earliest bonding processes used for this wafer level capping were anodic and glass frit bonding. Due to the constant pressures for cost reduction, size reduction, performance increase, increased integration, and shortened product life cycles the integration of MEMS devices with CMOS based circuitry is increasingly being considered and implemented. Consequentially, bonding, whether wafer to wafer or chip to wafer, has the additional role of being an enabling technology for the integration of CMOS and MEMS device. In this technology, the bond joint typically has multiple roles such as providing mechanical strength, electrical signal conductance, and sealing against various environmental agents or for vacuum encapsulation. |
| Starting Page | 576 |
| Ending Page | 579 |
| File Size | 1512852 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424485604 |
| e-ISBN | 9781424485628 |
| e-ISBN | 9781424485611 |
| DOI | 10.1109/EPTC.2010.5702704 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-12-08 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Metals Bonding Micromechanical devices CMOS integrated circuits Three dimensional displays Wafer bonding |
| Content Type | Text |
| Resource Type | Article |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|