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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yu Aibin Cheng Ming-Yuan Tan Kwanling Yu Daquan Teh Poh Giao Ramana, M.B. Je Minkyu |
| Copyright Year | 2010 |
| Description | Author affiliation: Institute of Microelectronics, A*STAR, (Agency for Science, Technology and Research), 11 Science Park Road, Singapore Science park II, Singapore 117685 (Yu Aibin; Cheng Ming-Yuan; Tan Kwanling; Yu Daquan; Teh Poh Giao; Ramana, M.B.; Je Minkyu) |
| Abstract | Assembly methods with specially designed Si interposer and Si platform are described for low profile 3D neural probe array assembly in this paper. In this method, in order to assemble the probe array with low profile and connect the probe with ASIC chips, an interposer is designed to connect the electrical pads on the sidewall of the probe and the electrical pads on the surface of the Application-specific integrated circuit (ASIC) chip. To hold the probe array and ASIC chip, a Si platform is designed with through Si slot for insertion of probe and cavity for holding the interposer. The electrical interconnections between the probe and the ASIC chip are formed by conventional flip chip bonding method. Therefore the throughput for the 3D probe array can be improved. Another advantage of the developed assembly method is that the backbone of the probe can be embedded inside the cavity of the Si platform, as a results, the profile of the probe array on top of the Si platform is controlled lower than 1mm easily, which make sure it does not touch skull after implant into the brain. |
| Starting Page | 721 |
| Ending Page | 725 |
| File Size | 1738503 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424485604 |
| e-ISBN | 9781424485628 |
| e-ISBN | 9781424485611 |
| DOI | 10.1109/EPTC.2010.5702732 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-12-08 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Probes Arrays Silicon Application specific integrated circuits Assembly Three dimensional displays Bonding |
| Content Type | Text |
| Resource Type | Article |
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