Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Che, F.X. Xiaowu Zhang Khan, N. Teo, K.H. Gao, S. Pinjala, D. |
| Copyright Year | 2010 |
| Description | Author affiliation: Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 11, Science Park Road, Science Park II, Singapore, 117685 (Che, F.X.; Xiaowu Zhang; Khan, N.; Teo, K.H.; Gao, S.; Pinjala, D.) |
| Abstract | Through-silicon-via (TSV) technology permits devices to be placed and wired in the third dimension. Currently, there is a strong motivation for the semiconductor industry to move to 3-D integration using the TSV approach due to many advantages of TSV application. However, there are also some challenges for stacked die package with TSVs. One of the challenges is thermo-mechanical reliability of multi-layer stacked chip modules when subjected to temperature cycling loading. In this paper, multi-layer stacked chip modules with 6 via-last memory chips and one via-middle logic chip were investigated in terms of thermo-mechanical reliability using finite element modeling and simulation method in the design stage for packaging material selection, solder joint layout design, package size effect on reliability, and solder joint fatigue life assessment and so on. The simulation results show that underfill is one of the most important parameters relating to solder joint thermal fatigue life. The effect of underfill glass transition temperature (Tg) and coefficient of thermal expansion (CTE) on solder joint life is significant. High Tg and low CTE underfill results in high solder joint life. Substrate CTE is another key parameter in terms of solder joint thermo-mechanical reliability. When underfill with low Tg is used in package, package with low CTE substrate results in high solder joint life. However, when high Tg underfill is used in package, the effect of substrate CTE on solder joint is not significant. In addition, the effects of following parameters on solder joint reliability have also been investigated: solder joint layout design of peripheral vs. full array, solder joint alloy (low Ag vs. high Ag content solder), mold compound (molding height, mold compound material properties), substrate thickness, TSV and die thickness effects. |
| Starting Page | 743 |
| Ending Page | 749 |
| File Size | 1498086 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781424485604 |
| e-ISBN | 9781424485628 |
| e-ISBN | 9781424485611 |
| DOI | 10.1109/EPTC.2010.5702736 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-12-08 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Soldering Reliability Substrates Strain Flip chip Through-silicon vias Fatigue |
| Content Type | Text |
| Resource Type | Article |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|