NDLI: A 32×32 integrated CMUT array for volumetric ultrasound imaging

Content Provider	IEEE Xplore Digital Library
Author	Bhuyan, A. Chienliu Chang Jung Woo Choe Byung Chul Lee Nikoozadeh, A. Oralkan, O. Khuri-Yakub, B.T.
Copyright Year	2013
Description	Author affiliation: Stanford Univ., Stanford, CA, USA (Bhuyan, A.; Chienliu Chang; Jung Woo Choe; Byung Chul Lee; Nikoozadeh, A.; Khuri-Yakub, B.T.) \|\| North Carolina State Univ., Raleigh, NC, USA (Oralkan, O.)
Abstract	Real-time 3D volumetric ultrasound imaging systems require transmit and receive circuitry to generate the ultrasound beam and process the received echo signals. Since a 2D array is required for 3D imaging, the complexity of building such a system is significantly higher, e.g., front-end electronics need to be interfaced to the transducer, a large number of elements need to be interfaced to the backend system and a large dataset needs to be processed. In this work, we present a 3D imaging system using capacitive micromachined ultrasonic transducer (CMUT) technology that addresses many of the challenges in building such a system. The transducer is a 5-MHz CMUT array with an 8 mm × 8 mm aperture size. The aperture consists of 1024 elements (32×32) with an element pitch of 250 μm. An integrated circuit (IC) is integrated very close to the CMUT array. It consists of a transmit beamformer and receive circuitry to improve the noise performance of the overall system. Simultaneous multi-beam transmit is also incorporated in the IC to improve the imaging frame rate. The CMUT is flip-chip bonded to the IC and the final assembly measured 9.2 mm × 9.2 mm. The assembly was then interfaced with an FPGA and a backend system (comprising of a data acquisition system and PC). The FPGA provided the digital I/O signals for the IC and the backend system was used to process the received RF echo data (from the IC) and reconstruct the volume image using a phased array imaging approach. Imaging experiments were performed using wire phantoms. Real-time volumetric images were captured at 5 volumes per second and are presented in this paper.
Sponsorship	IEEE Ultrason., Ferroelectr., Freq. Control Society
Starting Page	545
Ending Page	548
File Size	1780534
Page Count	4
File Format	PDF
ISSN	19485719
e-ISBN	9781467356862
DOI	10.1109/ULTSYM.2013.0141
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-07-21
Publisher Place	Czech Republic
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuits Arrays Imaging Ultrasonic imaging Three-dimensional displays Flip-chip devices Assembly integrated circuits 3D volumetric imaging capacitive micromachined ultrasonic transducer (CMUT) 2D array phased array imaging ultrasound real-time flip-chip bonding
Content Type	Text
Resource Type	Article

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