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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kariya, Y. Sato, K. Asari, S. Kanda, Y. |
| Copyright Year | 2010 |
| Description | Author affiliation: Materials Science and Engineering Department, Shibaura Institute of Technology, 3-7-5 Toyosu, Koto-ku, Tokyo, 135-8548 Japan (Kariya, Y.; Asari, S.) || Graduate school of Shibaura Institute of Technology, 3-7-5 Toyosu, Koto-ku, Tokyo, 135-8548 Japan (Sato, K.; Kanda, Y.) |
| Abstract | The influence of the joint size on low cycle fatigue characteristic of Sn-Ag-Cu has been investigated by a miniature joint specimen fabricated using micro solder balls. The influence of the size on crack initiation life is not remarkable, while the life which reaches complete failure reduces greatly when the ball size is decreased less than 150?m. The reduction in life is due to that the crack propagation stage does not appear and complete failure occurs simultaneously with the crack initiation in the ball size less than 150µm. The failure in the smallest size is induced by formation of subgrain boundary formation that occurs in whole area of the joint. |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 948465 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424453429 |
| ISSN | 10879870 |
| e-ISBN | 9781424453436 |
| DOI | 10.1109/ITHERM.2010.5501298 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-02 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Fatigue Soldering Semiconductor device packaging Testing Materials science and technology Semiconductor device reliability Thermal stresses Crystal microstructure Copper alloys Educational institutions Lead-free solder Sn-Ag-Cu Miniature testing Low-cycle fatigue Fracture Microstructure |
| Content Type | Text |
| Resource Type | Article |
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