NDLI: An improvement technique for the test compression ratio and application time of multiple expansion scan chain based SoC using new cost function

Content Provider	IEEE Xplore Digital Library
Author	Do Han Lee Tae Hee Han
Copyright Year	2014
Description	Author affiliation: Sch. of Inf. & Commun. Eng., Sungkyunkwan Univ., Suwon, South Korea (Tae Hee Han) \|\| Syst. LSI Bus., Samsung Electron. Co. Ltd., Giheung, South Korea (Do Han Lee)
Abstract	The importance of an efficient methodology for testing defects generated during IC manufacturing process is more than ever significant as the complexity of system on a chip (SoC) increases. Scan test is the most prevalent method for detecting stuck-at faults of digital integrated circuits. There are great demands for more efficient and lossless improvement techniques to reduce test cost growth caused by increase in chip density. In this paper, we propose a new multiple expansion scan chain (MESC) based technique by exploiting novel cost function considering additional variables for the total chain length of concatenated chains and sophisticated dependency analysis between each pair of chains. This proposed method is applied to two digital IP blocks of state-of-the-art mobile SoC fabricated in 14nm CMOS process. Experimental results show that the test data volume (TDV) is reduced by 10.4% and the longest chain length (LCL) decreases by 47.1% in maximum respectively when compared to existing works.
Starting Page	129
Ending Page	132
File Size	791839
Page Count	4
File Format	PDF
ISBN	9781479941346
ISSN	15483746
e-ISBN	9781479941322
DOI	10.1109/MWSCAS.2014.6908369
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-08-03
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Cost function Automatic test pattern generation Circuit faults System-on-chip IP networks Very large scale integration Clocks Logic Cone Analysis Test Data Volume Multiple Expansion Scan Chain Dependency Analysis Longest Chain Length
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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