NDLI: Improvement of Reversible Strain Limit for Critical Current of DI-BSCCO Due to Lamination Technique

Content Provider	IEEE Xplore Digital Library
Author	Osamura, K. Machiya, S. Suzuki, H. Ochiai, S. Adachi, H. Ayai, N. Hayashi, K. Sato, K.
Copyright Year	2002
Abstract	The DI (dynamically innovative)-BSCCO-Bi2223 tapes achieved high critical current as well as high modulus of elasticity. Further the reversible strain limit and the corresponding stress for critical current have been remarkably increased by means of lamination technique. During the course of development, their optimized architecture has been designed based on the principle of the rule of mixture for maximizing the force free strain exerted on the superconducting component. The reversible strain/stress limit (A _rev/R _rev) was defined as a strain, at which the critical current recovers to the level of 99% I _co. Selecting several kinds of laminating materials and changing condition of the fabrication, the excellent Cu alloy-3ply tape with I _co of 311 A/cm was realized of which A _rev and R _rev reached 0.42% and 300 MPa, respectively. Further during the theoretical analysis, the increase of reversible strain limit were made clear to be attributed to the increase of thermally induced residual strain as well as the compensation effect of laminated layers against a local fracture mode.
Sponsorship	Council on Superconductivity Appl. Superconductivity Conference Inc MIT
Starting Page	3026
Ending Page	3029
Page Count	4
File Size	332442
File Format	PDF
ISSN	10518223
Volume Number	19
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Capacitive sensors Critical current Lamination Residual stresses Elasticity Superconducting films Materials science and technology Strain measurement Superconductivity Silver residual strain BSSCO-Bi2223 critical current force free strain modulus of elasticity
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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