NDLI: Application of eddy-current testing technique for high-density double-Layer printed circuit board inspection

Content Provider	IEEE Xplore Digital Library
Author	Chomsuwan, K. Yamada, S. Iwahara, M. Wakiwaka, H. Shoji, S.
Copyright Year	1965
Abstract	High-density double-layer printed circuit board (PCB) inspection based on the eddy-current testing (ECT) technique is proposed in this paper. The ECT probe, which consisted of a planar meander exciting coil and spin-valve giant magnetoresistance (SV-GMR) sensor array, is used for this propose. Defects on both the top- and bottom-layer of the high-density double-layer PCB are examined by the ECT technique with scanning over either the top or bottom layer. The characteristics of the proposed ECT probe for high-density double-layer PCB inspection are studied. The inspection results of the high-density double-layer PCB model verify that applying the ECT technique enables identification of the defects of both the top and bottom layer with one-side scanning.
Sponsorship	IEEE Magnetics Society
Starting Page	3619
Ending Page	3621
Page Count	3
File Size	860663
File Format	PDF
ISSN	00189464
Volume Number	41
Issue Number	10
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-10-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Circuit testing Printed circuits Inspection Electrical capacitance tomography Sensor arrays Probes Coils Giant magnetoresistance Magnetic sensors Sensor phenomena and characterization spin-valve giant magnetoresistance (SV-GMR) Eddy-current testing (ECT) inspection printed circuit board (PCB)
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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