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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chabok, H.R. Cannata, J.M. Hyung Ham Kim Shung, K.K. |
| Copyright Year | 2009 |
| Description | Author affiliation: Biomedical Engineering Department, NIH Transducer Resource Center, University of Southern California, Los Angeles, USA (Chabok, H.R.; Cannata, J.M.; Hyung Ham Kim; Shung, K.K.) |
| Abstract | The design, fabrication, and testing of 1–3 composite annular array transducers is presented. An interdigital bonded (IB) 1–3 composite was manufactured using two IB operations on a fine-grain piezoelectric ceramic. Unloaded epoxy was used for both the matching and backing layers and a flexible circuit was used for interconnect. The final composite had 19µm wide posts separated by 6µm wide polymer kerfs. One array was tested and the results were found to be in good agreement with KLM modeled results. The average measured pulse-echo response for array elements was 34.3 MHz with 57.5 % −6 dB bandwidth. The maximum crosstalk between neighbor elements was −38.5 dB. A novel fabrication step greatly simplified fabrication process by eliminating the need for electrode patterning and alignment of that pattern between the composite and flex circuit. |
| Starting Page | 2708 |
| Ending Page | 2711 |
| File Size | 2089504 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424443895 |
| ISSN | 19485727 |
| DOI | 10.1109/ULTSYM.2009.5441999 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-09-20 |
| Publisher Place | Italy |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Frequency Ultrasonic transducer arrays Ultrasonic imaging Ultrasonic transducers Bonding Fabrication Piezoelectric transducers Circuit testing Pulse measurements Manufacturing high frequency composite annular array |
| Content Type | Text |
| Resource Type | Article |
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