NDLI: Minimizing the bottom reflection in Ultrasonic CMUT Transducer backing using low profile structuring

Content Provider	IEEE Xplore Digital Library
Author	Chapagain, K.R. Rnnekleiv, A.
Copyright Year	2009
Description	Author affiliation: Department of Electronics and Telecommunications, Norwegian University of Science and Technology, NTNU, 7491 Trondheim, Norway (Chapagain, K.R.; Rnnekleiv, A.)
Abstract	Capacitive Micro-machined Ultrasonic Transducer (CMUT) transducers need an acoustic backing to ensure that any acoustic signal which propagates from the transducer into the substrate is absorbed in the backing. The backing should be made such that it does not give a false echo in the signal received by or transmitted from the transducer. Ideally, this backing material should provide high attenuation and it should match the acoustic impedance of the CMUT supporting structure (usually silicon). To avoid the echoes described above, a thick backing layer is required. But in many cases, there is little space available under the transducer so that it is difficult to accommodate a sufficiently thick layer of material with realistic propagation losses, to ensure that no signal is reflected back to the transducer. In this paper, we discuss irregular structures at the bottom surface that are used to scatter the waves. The proposed structure scatters the waves into waves with significantly changed propagation directions, giving long propagation paths back to the transducer. The structure is analyzed using FEM simulations for a simple 2D case. Different ways of implementing the structure is also discussed.
Starting Page	430
Ending Page	433
File Size	2200324
Page Count	4
File Format	PDF
ISBN	9781424443895
ISSN	19485727
DOI	10.1109/ULTSYM.2009.5441721
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-09-20
Publisher Place	Italy
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Ultrasonic transducers Acoustic transducers Acoustic scattering Acoustic reflection Acoustic propagation Acoustic materials Attenuation Impedance Silicon Propagation losses
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in