NDLI: Chip on Board Technology for Low Cost Multi-Chip-Modules

Content Provider	IEEE Xplore Digital Library
Author	Clot, P. Sarbach, P. Styblo, D.
Copyright Year	1994
Description	Author affiliation: Valtronic USA Inc., Ohio (Clot, P.)
Abstract	Multi-Chip-Module on a laminated epoxy-glass substrate (MCM-L) meets the demand for a low cost miniaturized module when many functions with different technologies need to be integrated in a single standard package. The following paper presents two original MCM-L designs using Chip On Board (COB) technology. Both are made on the same kind of modified multilayer glass epoxy ; one is equiped with J lead ouput pins allowing the mounting of dice on both faces, the second is very thin with dice mounted on the top face and bumps on the bottom face allowing direct soldering on the motherboard like other Surface Mount Device (SMD) components. These two kinds of MCM modules with Jedec standard dimensions are now pushed into production. Mounting procedure as well as qualification program and test approach are described. To ensure reliability of such MCMs it becomes important to know exactly the maximal stress and deformation induced by thermal or mechanical cycles during mounting procedure. The use of the Finite Element Method (FEM) for design optimization is explained. This method allows the calculation of deformation, stress and temperature distribution in the whole module during the development phase. The results of such simulation are presented here.
Starting Page	455
Ending Page	460
File Size	425653
Page Count	6
File Format	PDF
ISBN	0930815394
DOI	10.1109/ICMCM.1994.753589
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-04-13
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Thermal stresses Cost function Glass Pins Finite element methods Electronics packaging Thermal resistance Heat sinks Paper technology
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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