NDLI: Redefining the Economics of Mcm Applications

Content Provider	IEEE Xplore Digital Library
Author	Cokely, D. Strittmatter, C.
Copyright Year	1994
Description	Author affiliation: AT&T-Shreveport, Louisiana (Cokely, D.)
Abstract	The economics governing the decision to design and integrate MCMs into products is often limited to comparison of the associated material costs. In many cases, MCM material costs exceed that of the discretes and integrated circuits which it could potentially replace. Such narrow focus has contributed to a stifling of the MCM technology explosion. Equitable comparisons must be made through a full stream system analysis with consideration given to feature enhancement, overall yield, labor, load and warranty impacts on the end product. MicroInterconnect Technology is an extension of traditional MCMs in that integration of functions can result in space and performance improvements. However, when ICs are flipped to a silicon substrate containing active and passive devices, component count decreases significantly and the critical system performance metrics, are further improved. At AT&T-Shreveport, small business telephone systems are manufactured to compete with other "commodity" vendors in the world market. Success in this high volume environment requires aggressive cost management and achievement of reliability levels consistent with consumer expectations. The Partner/sup R/ Product Management Team will be the first to integrate flip-chip, silicon-on-silicon, MicroInterconnect MCM technology by 2Q94. Successive cost reductions will be enabled with the introduction of MicroInterconnect Technology which positively affect system cost and performance.
Starting Page	306
Ending Page	313
File Size	314018
Page Count	8
File Format	PDF
ISBN	0930815394
DOI	10.1109/ICMCM.1994.753567
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-04-13
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Silicon Fabrics Environmental economics Space technology Integrated circuit technology Manufacturing Cities and towns Explosions Integrated circuit yield
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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