NDLI: Heat-Pipe Cooling Technology for High-Speed Atm Switching Mcms

Content Provider	IEEE Xplore Digital Library
Author	Kishimoto, T. Sasaki, S. Genda, K. Endo, K. Kaizu, K.
Copyright Year	1994
Description	Author affiliation: NTT Electronics Technology Inc., Japan (Kishimoto, T.)
Abstract	This paper describes an innovative heat-pipe cooling technology for high-speed ATM switching MCMs operating with a throughput of 40 Gb/s. Although high-speed ATM link wires are interconnected on the top surface of the MCMs, there is no room to coot the MCM by forced air convection, because the power and the system clock signal are supplied by the connector on the back side and peripheral of the MCM. We therefore attach a cold-plate to the back of each MCM. The condenser parts of the heat pipe, which is mounted behind the power supply printed circuit board, are cooled by low-velocity forced air. Total power dissipation including the power dissipation of the termination resistors is about 30 watts per MCM. With a 2 m/s forced air flow, this sub-switching element module operates at a throughput of 80 Gb/s (including 4 MCMs) with maximum junction temperature of less than 85 /spl deg/C. Measured thermal resistance between the switch LSI junction and air is about 6 /spl deg/C/W at an air flow of 2 m/s. This heat-pipe cooling system has small system footprint, compact hardware, and good cooling capability. We, demonstrate its effectiveness in cooling high-speed ATM switching MCMS operating with a throughput of 40 Gb/s.
Starting Page	142
Ending Page	150
File Size	936814
Page Count	9
File Format	PDF
ISBN	0930815394
DOI	10.1109/ICMCM.1994.753543
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-04-13
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Asynchronous transfer mode Packaging Switches Communication switching Power supplies Large scale integration Electronics cooling Throughput Connectors Switching systems
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in