NDLI: MCM-L Cost Model & Application Case Study

Content Provider	IEEE Xplore Digital Library
Author	Begay, M.J. Cantwell, R.
Copyright Year	1994
Description	Author affiliation: DSC Communications Corporation, TX (Begay, M.J.)
Abstract	Since the recent advent of the MultiChip Module (MCM) technology options, many potential MCM customers are grappling on how to partition a new or existing system design to utilize the benefits of MCMs. In addition to the design issues, customers are having to look beyond the traditional board design cost models to justify the higher costs of MCMs over the single chip package options. These factors greatly influence the decision whether to design or redesign a system with an MCM. Unless the customer can readily determine whether cost savings or parity can be achieved with a MCM, the decision to use an MCM is either postponed or dropped as an alternative. This paper will outline the design and cost methods that were used in a telecommunication switching equipment application. This application substituted a multi-layer, four chip, 160 lead MCM-L PQFP (plastic quad flat pack) package in place of four single chip packages. The methods used in this case study delves beyond the traditional single chip versus multichip package comparisons to justify the use of a MCM-L package as a cost effective alternative to single chip semiconductor devices.
Starting Page	332
Ending Page	337
File Size	592904
Page Count	6
File Format	PDF
ISBN	0930815394
DOI	10.1109/ICMCM.1994.753571
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-04-13
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Computer aided software engineering Semiconductor device packaging Packaging machines Multichip modules Telecommunication switching Plastic packaging Switches Application specific integrated circuits System analysis and design
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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