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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Woo, Daniel Rhee Min Yun, Jason Au Keng Jun, Yu Ching, Eva Wai Leong Che, F.X. |
| Copyright Year | 2014 |
| Description | Author affiliation: Institute of Microelectronics, A∗STAR (Agency for Science, Technology and Research) 11 Science Park Rd, Singapore Science Park II, Singapore 117685 (Woo, Daniel Rhee Min; Yun, Jason Au Keng; Jun, Yu; Ching, Eva Wai Leong; Che, F.X.) |
| Abstract | The extremely high temperature and high pressure endurable (250°C/30kspi) SOI based temperature sensor and voltage regulator module was developed for harsh environment application such as deep sea, oil & gas down-hole drilling and aerospace engine electronics. The hermetically sealed metal casing which can withstand external pressure up to 30 kpsi was designed and optimized through mechanical modeling and characterization. In side of this hermetic casing, the physical layout of SOI devices and ruggedized components for temperature sensor and voltage regulator was fabricated on ceramic substrate assembled by high temperature endurable interconnection materials such as Au-Sn, Au-Ge and Ag sintering materials. The developed modules are tested with specified reliability testing criteria and evaluation results shows that the packaging and interconnection showed still functional after high temperature storage (HTS) test of 250°C for 500 h and temperature cycling condition −55°C∼250°C for 500 cycles. Also passed 30kpsi pressure cycling and other deep sea and down hole drilling environment test. Those results demonstrate that current SOI sensor module with hermetically sealed metal casing package's design, material and process are considered to be applicable for extreme-HTHP application meeting huge demands in automotive, aerospace engine electronics, down-hole drilling, geothermal and deep sea applications for future. |
| Starting Page | 16 |
| Ending Page | 21 |
| File Size | 876909 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781479969944 |
| DOI | 10.1109/EPTC.2014.7028382 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-12-03 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Temperature sensors Ocean temperature Wires Reliability Metals Materials Bonding |
| Content Type | Text |
| Resource Type | Article |
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