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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Ding, Mian Zhi Kantak, Chaitanya Rao, Vempati Srinivasa Park, Mi Kyoung Wong, Chee Chung |
| Copyright Year | 2014 |
| Description | Author affiliation: Institute of Microelectronics, A∗STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore Science Park II, Singapore 117685 (Ding, Mian Zhi; Kantak, Chaitanya; Rao, Vempati Srinivasa; Park, Mi Kyoung; Wong, Chee Chung) |
| Abstract | In recent years, advanced incorporation of complementary metal oxide semiconductor (CMOS) biosensor chips with sensory microarrays has gained tremendous attention. In this paper, we investigated a maskless approach to microfluidic channel fabrication that integrates seamlessly with CMOS biosensor chip packaging. The microfluidic channels were formed via precisely controlled dispensing of adhesive to define microfluidic dam structures. This was followed by encapsulation of the microfluidic dam with a lid, thereby producing an impervious seal. Four types of commercial adhesives used in medical/implantable devices were evaluated in this study; a silicone-based adhesive, an ultraviolet curable epoxy, an ultraviolet curing acrylate adhesive, and a thermal curing epoxy. The adhesives were evaluated based on the performance criteria such as: (i) critical dimension (CD) of microfluidic channels, (ii) minimum microfluidic dam height, (iii) biocompatibility, and (iv) bond strength of the adhesive between CMOS substrate film to the lid material. The test vehicles comprising of ITO glass lid material, SiN substrate material and various evaluated adhesives, were subjected to burst pressure leak test. From the results obtained, Dow Corning® 3140 silicone-based adhesive has the best performance as a suitable adhesive for microfluidic dam structure formation. Lastly, a seamless approach to integrating electronic and microfluidic packaging through the use of controlled adhesive dispensing and a pick and place assembly tool was demonstrated with the use of Dow Corning® 3140 adhesive for microfluidic biological applications. |
| Starting Page | 713 |
| Ending Page | 718 |
| File Size | 540043 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781479969944 |
| DOI | 10.1109/EPTC.2014.7028299 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-12-03 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Microfluidics Packaging Glass Needles Indium tin oxide Bonding Biosensors |
| Content Type | Text |
| Resource Type | Article |
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