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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kim, Jaewon Lee, Byunghoon Lek, Jun Yan Made, Riko I. Salam, Budiman Gan, Chee Lip |
| Copyright Year | 2014 |
| Description | Author affiliation: Singapore Institute of Manufacturing Technology (SIMTech), Large Area Processing Programme, Singapore (Salam, Budiman) || Singapore-MIT Alliance for Research and Technology - Low Energy Electronics System, Singapore (Made, Riko I) || School of Materials Science and Engineering, Nanyang Technological University, Singapore (Kim, Jaewon; Lee, Byunghoon; Lek, Jun Yan; Gan, Chee Lip) |
| Abstract | Printed interconnects on flexible substrates using copper nanoparticles ink is attractive because of its lower material cost, lower electrical resistivity and higher electromigration resistance as compared to gold or silver-based ink. However, Cu nanoparticles oxidize easily during the sintering process, which has an adverse effect on its quality and reliability. Thus, it requires process modifications such as sintering in an inert environment to reduce the oxidation effects. In this paper, the properties of nano-sized Cu particles ink-jet printed conductive films that were sintered in N2 environment are investigated. The sheet resistance and microstructure of the Cu films were monitored as a function of temperature. |
| Starting Page | 27 |
| Ending Page | 30 |
| File Size | 370237 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479969944 |
| DOI | 10.1109/EPTC.2014.7028308 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-12-03 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Nanoparticles Ink Copper Films Resistance Substrates Microstructure |
| Content Type | Text |
| Resource Type | Article |
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