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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | He, Yi Liu, Fengman Wu, Peng Hou, Fengze Li, Jun Pan, Jie Shangguan, Dongkai Cao, Liqiang |
| Copyright Year | 2014 |
| Description | Author affiliation: National Center for Advanced Packaging (NCAP CHINA) Building D1, 200 Linghu Boulevard, Wuxi City, Jiangsu Province, China, 214135 (He, Yi; Liu, Fengman; Wu, Peng; Hou, Fengze; Li, Jun; Pan, Jie; Shangguan, Dongkai; Cao, Liqiang) |
| Abstract | Today a range of wireless communication products have the requirement of achieving a higher integration level. In this paper, we propose two RF SiPs based on a RF prototype board for micro base station. The two RF SiPs integrate a complete 700–2600MHz RF system that includes transmitter, receiver, and feedback module, ADC/DAC and clock module. RF SiP 1 consists of two multilayer organic substrates, which are vertically stacked by using Ball BGA interconnections. RF SiP 2 uses flexible substrate as the interconnections between the top and the bottom substrates. Compared with the original RF part on the prototype board (20cm×25cm), the size of the two RF SiPs is 5.25m×5.25cm, almost reducing system area 20 times. By comparison, the flexible substrate on RF SiP 2 provides better transmission quality of input RF signals and RF SiP 2 shares better thermal performance. Besides, the RF SiP 1 uses more conventional processes and has the potential to be fabricated with a lower cost. |
| Starting Page | 48 |
| Ending Page | 51 |
| File Size | 233255 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479969944 |
| DOI | 10.1109/EPTC.2014.7028293 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-12-03 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Radio frequency Substrates Prototypes Cavity resonators Wireless communication Nonhomogeneous media Base stations system integration RF SiP |
| Content Type | Text |
| Resource Type | Article |
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