NDLI: Inter-connecting process investigation to resolve delamination

Content Provider	IEEE Xplore Digital Library
Author	Lee, Bob Chou, Stanley
Copyright Year	2014
Description	Author affiliation: Texas Instruments Taiwan Limited 142, Sec. 1, HsinNan Rd. Chung Ho Dist. New Taipei City, Taiwan (Lee, Bob; Chou, Stanley)
Abstract	Delamination on the interface between mold compound to die, die paddle and inner leads study has been on-going for quite some time. This is a chronicle defect which will result in electrical continuity failure if delamination penetrates into the interface of mold compound to die surface and mold compound to inner leads e.g., delamination on inner leads or die surface to cause wire broken after thermal stress. To resolve delamination, better materials are needed such as Lead frame, die attach and mold compound. Other than that, a process optimization is also a must to achieve delamination free result. The paper portrays the phenomenon of how delamination occurred after improving the BOM e.g., less water absorption and higher adhesion mold compound. During qualification stage, no delamination occurred after thermal stress. But, on mass volume production run, the delamination occurs on inner leads by sampling check. Four “M” Men, Material, Method and Machines are thoroughly checked and compared with its qualification built and mass production run. No difference or conclusion can be observed and made. But, the delamination was there though no finding/difference was observed. However, one conclusion can be made is qualification is small volume but mass confirmation run is large volume. Based on the assumption, Delamination comparison between small volume VS. large volume was conducted to check the difference. Then, the root cause as die attach outgassing to cause contamination on package is observed. The contamination is later turn into delamination after Thermal.
Starting Page	641
Ending Page	644
File Size	2972921
Page Count	4
File Format	PDF
ISBN	9781479969944
DOI	10.1109/EPTC.2014.7028292
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-12-03
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microassembly Delamination Materials Compounds Contamination Thermal stresses Lead
Content Type	Text
Resource Type	Article

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