NDLI: Meshim: A high-level performance simulation platform for three-dimensional network-on-chip

Content Provider	IEEE Xplore Digital Library
Author	Menwang Xie Duoli Zhang Yao Li
Copyright Year	2011
Description	Author affiliation: Hefei University of Technology, China (Duoli Zhang) \|\| University of Science and Technology of China, Hefei, China (Menwang Xie; Yao Li)
Abstract	Three dimensional network-on-chip (3D NoC) is motivated to achieve better performance, functionality, and packaging density compared to 2D NoC. To facilitate performance evaluation for the design stage, an accurate and flexible environment for simulating the 3D NoC performance is necessary. In this paper, we present a complete high-level simulation platform for 3D NoC called Meshim, based on SystemC, including models for processors, mesh-based communication architecture, and memory models. To demonstrate that our simulation platform is a powerful tool for 3D NoC design stage, we use our platform to explore the performance of architectures based on real applications. The simulation results show that our implemented 3D NoC architecture provides better performance than 2D NoC architecture, and this distinction becomes more obvious when the workload grows up.
Starting Page	349
Ending Page	352
File Size	1114534
Page Count	4
File Format	PDF
ISBN	9781612841922
ISSN	2162755X
e-ISBN	9781612841939
e-ISBN	9781612841915
DOI	10.1109/ASICON.2011.6157193
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-10-25
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit modeling Process control Biological system modeling Switches design space exploration high-level simulation 3D NoC
Content Type	Text
Resource Type	Article

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