NDLI: Fluxless reflow of eutectic solder bump using formic acid

Content Provider	IEEE Xplore Digital Library
Author	Yong-Shan Lin Chun-Hsing Shih Wei Chang
Copyright Year	2009
Description	Author affiliation: Institute of Electronics Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan (Wei Chang) \|\| Department of Electronics Engineering, National United University, Miaoli 36003, Taiwan (Chun-Hsing Shih) \|\| Department of Electrical Engineering, Yuan Ze University, Taoyuan 32003, Taiwan (Yong-Shan Lin)
Abstract	This work elucidates the solder reflow of eutectic (63Sn/37Pb) solder bump using fluxless formic acid. The dependences of formic acid reflow on metallic oxide reduction are investigated experimentally for eutectic solder bump. Appropriate temperature profile and sufficient formic acid concentration are the key factors to optimize the metallic oxide reduction during thermal reflow. A positive pressure in process chamber is beneficial to control the variations of unwanted oxygen and the regrowth of metallic oxide during mechanical wafer switching. A reflowed solder joint degrades considerably under shear strength testing after several reflow times.
Starting Page	514
Ending Page	517
File Size	663168
Page Count	4
File Format	PDF
ISBN	9789810824686
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-12-14
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	NANYANG TECHNOLOGICAL UNIV
Subject Keyword	formic acid Scanning electron microscopy Charge carriers Semiconductor materials Circuits Radiative recombination Charge measurement fluxless reflow Spontaneous emission Electron beams flip chip package Current measurement eutectic solder bump Probes
Content Type	Text
Resource Type	Article

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