NDLI: P1J-1 Optimized Piezoelectric Sol-Gel Composite Films for High Frequency Ultrasonic Transducers

Content Provider	IEEE Xplore Digital Library
Author	Bardaine, A. Boy, P. Belleville, P. Acher, O. Levassort, F.
Copyright Year	2007
Description	Author affiliation: Lab. Sol Gel, Monts (Bardaine, A.; Boy, P.; Belleville, P.; Acher, O.)
Abstract	High frequency piezoelectric films were prepared using the composite sol-gel technique, by mixing PZT sol and laboratory-made powders, free-cracked thick films were deposited by dip-coating on silicon, alumina and porous PZT substrates. Only 3 composite layers and few final infiltrations were used to prepare 40 mum thick films. Reproducible electromechanical properties, i.e. thickness coupling coefficients around 40%, were obtained after a poling at 15V mum in an oil bath at 170degC. A pulse echo response was measured with a 35 mum thick film deposited on a porous PZT substrate. The corresponding characteristics are an axial resolution of 45 mum (with a bandwidth at 80*%) at -6dB and a center frequency of 20 MHz. These results showed that the composite sol-gel process is a good candidate to produce piezoelectric films with a thickness of few tens of microns with a minimization of fabrication steps.
Starting Page	1448
Ending Page	1451
File Size	425703
Page Count	4
File Format	PDF
ISBN	9781424413836
ISSN	10510117
DOI	10.1109/ULTSYM.2007.364
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-10-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Piezoelectric films Frequency Ultrasonic transducers Thick films Substrates Pulse measurements Laboratories Powders Dip coating Silicon
Content Type	Text
Resource Type	Article

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