NDLI: 6F-3 Fabrication and Assembly of a Monolithic 3D CMUT Array for Imaging Applications

Content Provider	IEEE Xplore Digital Library
Author	Xiaoyang Cheng Jingkuang Chen I-Ming Shen Pai-Chi Li Mengli Wang
Copyright Year	2007
Description	Author affiliation: Univ. of New Mexico, Albuquerque (Xiaoyang Cheng; Jingkuang Chen)
Abstract	This paper describes a novel architecture for integration of polysilicon capacitive micromachined ultrasonic imager array on a 3D hexagonal silicon platform for simultaneous multi-directional viewing. Integrated with seven CMUT arrays oriented at seven different directions, this three-dimensional hexagonal imager prism is capable of viewing the front direction and 360deg side directions concurrently. The seven CMUT-array plates were monolithically fabricated on one silicon substrate using a surface micromachining process. The silicon substrate under the connection areas between the imager plates was then completely etched away using a selective backside deep silicon etching, leaving behind flexible dielectric films for inter-plate connection. In addition to providing mechanical linkage, these dielectric connecting films also support the thin-film electrical interconnects between the imagers on different plates. The seven CMUT arrays were then folded into a miniature prism and glued together using epoxy. Hexagonal imager prisms with width across corner of the hexagon, ranging from 500 mum to 4 millimeters in width, and 2 to 4 millimeters in length have been prototyped and tested. The CMUT devices behaved consistently before and after the assembly process. This architecture allows one monolithically integrated or flip-chip bonded beam-forming circuit to control all the imagers on this miniature prism and the number of bonding wires can be minimized. The multi- direction viewing capability and miniature size make this device capable of delivering more comprehensive information for internal medical imaging applications.
Starting Page	515
Ending Page	518
File Size	1148798
Page Count	4
File Format	PDF
ISBN	9781424413836
ISSN	10510117
DOI	10.1109/ULTSYM.2007.136
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-10-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fabrication Assembly Silicon Dielectric substrates Etching Dielectric films Dielectric thin films Millimeter wave devices Bonding Ultrasonic imaging
Content Type	Text
Resource Type	Article

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