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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Petit, D. Abele, N. Volatier, A. Lefevre, A. Ancey, P. Carpentier, J.-F. |
| Copyright Year | 2007 |
| Description | Author affiliation: STMicroelectronics, Crolles (Petit, D.) |
| Abstract | The design of bulk acoustic wave "BAW" resonators should take into account the stringent requirements of thermal effects. In this paper, we propose a thermal model, allowing the reduction of the Temperature Coefficient of Frequency "TCF" with a slightly modified process while retaining a good coupling and quality factor. For a significant reduction of the TCF, a $SiO_{2}$ layer is added above the upper electrode. A TCF of +1.5 ppm/degC was obtained at 2.08 GHz. The present accuracy of the ID model is approximately 1 ppm/degC. Most material parameters were extracted by comparison between the modeling and the measurement of BAW resonators with different stacks. To improve the dispersion of the TCF, the uniformity of each layer is introduced into the model. Firstly, the reduction of the top $SiO_{2}$ Bragg layer thickness dispersion from 2 % to 0.2 % is achieved, using an ion etching. The compensation of BAW resonators in our process has been improving for PCS diversity standard. This model was used to design a Personal Communications Service "PCS" RX diversity filter (1.93-1.99 GHz). The compensated loaded and unloaded resonators were used in the filtering function and present TCFs between 0.8 and -7 ppm/degC with a coupling factor of approximately 5.2 %. |
| Starting Page | 1243 |
| Ending Page | 1246 |
| File Size | 551896 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424413836 |
| ISSN | 10510117 |
| DOI | 10.1109/ULTSYM.2007.312 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-10-28 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Acoustic waves Temperature Radio frequency Resonator filters Personal communication networks Filtering Thermal factors Q factor Electrodes Etching |
| Content Type | Text |
| Resource Type | Article |
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