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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Schmidt, R. Iyengar, M. Porter, D. Weber, G. Graybill, D. Steffes, J. |
| Copyright Year | 2010 |
| Description | Author affiliation: IBM Corporation, 2455 South Road, Poughkeepsie, N.Y. 12601, USA (Schmidt, R.; Iyengar, M.; Porter, D.; Weber, G.; Graybill, D.; Steffes, J.) |
| Abstract | The heat dissipated by electronic equipment continues to increase at a alarming rate. This has occurred for products covering a wide range of applications. Manufacturers of this equipment require that the equipment be maintained within an environmental envelope in order to guarantee proper operation. Achievement of these environmental conditions are becoming increasingly difficult given the increases in rack heat loads and the desire for customers of such equipment to cluster racks in a small region for increased performance. And with the increased heat load of the racks and correspondingly increased air flowrate the chilled air flow supplied either through data center raised floor perforated tiles or diffusers for non raised floors is not sufficient to match the air flow required by the datacom racks. In this case some of the hot air exhausting the rear of a rack can return to the front of the rack and be ingested into the air intake thereby reducing the reliability of the electronic equipment. This paper describes a method to reduce the effect of the hot air recirculation with a water cooled heat exchanger attached to the side of a rack. This heat exchanger removes all of the heat load of a rack up to 35 kW(27° C ambient temperature and 15° C inlet water temperature) thereby having a netzero impact to the data center environmental. This paper describes the unique design of the open side car and presents the test results showing that it removes all the server heat load up to 35 kW and has minimal impact on the flow and resulting component temperatures within the server packages. This open side car design will show improvement in energy efficient heat load removal equipment compared to those currently being shipped in the marketplace. |
| Starting Page | 1 |
| Ending Page | 6 |
| File Size | 278969 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424453429 |
| ISSN | 10879870 |
| e-ISBN | 9781424453436 |
| DOI | 10.1109/ITHERM.2010.5501423 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-02 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Temperature Water heating Tiles Electronic equipment Floors Humidity Electronic equipment manufacture Cooling Air conditioning Maintenance IT infrastructure supporting hardware Side car water cooled data center heat exchanger |
| Content Type | Text |
| Resource Type | Article |
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