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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Seung-Hyun Chae Jie-Hua Zhao Edwards, D.R. Ho, P.S. |
| Copyright Year | 2010 |
| Description | Author affiliation: Texas Instruments, Inc., Dallas, 75243, U.S.A. (Jie-Hua Zhao; Edwards, D.R.) || The University of Texas at Austin, 78758, U.S.A. (Seung-Hyun Chae; Ho, P.S.) |
| Abstract | The ball-on-ring (BOR) test is an effective technique used to characterize the biaxial fracture strength of brittle materials. In particular, damages induced by wafer backgrinding process can be evaluated using the BOR test. It is difficult to measure directly the radius of contact area between the loading ball and a specimen, which is needed for stress determination by an analytic solution. In this study, parametric finite element analyses were performed to compare with known closed-form solutions. It was found that the effect of small loading area must not be ignored and that the radius of contact could be precisely determined using Hertz's contact theory. This can serve as a guideline to accurately obtain the fracture strength of a BOR specimen. |
| Starting Page | 1 |
| Ending Page | 6 |
| File Size | 675415 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424453429 |
| ISSN | 10879870 |
| e-ISBN | 9781424453436 |
| DOI | 10.1109/ITHERM.2010.5501307 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-02 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Finite element methods Closed-form solution Tensile stress Materials testing Area measurement Performance analysis Instruments Stress measurement Guidelines Steel finite element method ball-on-ring (BOR) biaxial strength Si die fracture equivalent radius contact radius |
| Content Type | Text |
| Resource Type | Article |
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