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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lall, P. Gupta, P. Panchagade, D. Angral, A. |
| Copyright Year | 2010 |
| Description | Author affiliation: Auburn University, Department of Mechanical Engineering, NSF Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3), AL 36849, USA (Lall, P.; Gupta, P.; Panchagade, D.; Angral, A.) |
| Abstract | In this paper, a new technique has been developed for health monitoring and failure mode classification based on measured damage pre-cursors. A feature extraction technique in the joint-time frequency domain has been developed along with pattern classifiers for fault diagnosis of electronics at product-level. The Karhunen Loéve transform (KLT) has been used for feature reduction and de-correlation of the feature vectors for fault mode classification in electronic assemblies. Euclidean, and Mahalanobis, and Bayesian distance classifiers based on joint-time frequency analysis, have been used for classification of the resulting feature space. In this paper, various fault modes such as solder inter-connect failure, inter-connect missing, chip delamination chip cracking etc in various packaging architectures have been classified using clustering of feature vectors based on the KLT approach. The clustered damage pre-cursors have been correlated with underlying damage. Several chip-scale packages have been studied, with leadfree second-level interconnects including SAC105, SAC305 alloys. Transient strain has been measured during the drop-event using digital image correlation and high-speed cameras operating at 100,000 fps. Continuity has been monitored simultaneously for failure identification. Fault-mode classification has been done using KLT and joint-time- frequency analysis of the experimental data. In addition, explicit finite element models have been developed and various kinds of failure modes have been simulated such as solder ball cracking, trace fracture, package falloff and solder ball failure. Models using cohesive elements present at the solder joint-copper pad interface at both the PCB and package side have also been created to study the traction-separation behavior of solder. Fault modes predicted by simulation based pre-cursors have been correlated with those from experimental data. |
| Starting Page | 1 |
| Ending Page | 14 |
| File Size | 1591906 |
| Page Count | 14 |
| File Format | |
| ISBN | 9781424453429 |
| ISSN | 10879870 |
| e-ISBN | 9781424453436 |
| DOI | 10.1109/ITHERM.2010.5501289 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-02 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Electric shock Karhunen-Loeve transforms Packaging Condition monitoring Strain measurement Feature extraction Frequency domain analysis Fault diagnosis Assembly Bayesian methods faultmode isolation Prognostic health monitoring shock and vibration condition monitoring anomaly detection |
| Content Type | Text |
| Resource Type | Article |
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