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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lall, P. Shantaram, S. Panchagade, D. |
| Copyright Year | 2010 |
| Description | Author affiliation: Auburn University, Department of Mechanical Engineering, NSF Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3), AL 36849, USA (Lall, P.; Shantaram, S.; Panchagade, D.) |
| Abstract | Electronic packages subjected to drop and shock have been simulated using alternative theory known as peridynamic theory in the realm of FEM. In peridynamics, problems are formulated in terms of integral equation which is a substitute to conventional solid mechanics theory where problems are formulated in terms of partial differential equations. This alternative approach is more potent than conventional finite-element method because the integral equations remain valid even at discontinuities which enables to model crack initiation and crack propagation which can occur at multiple locations simultaneously. Previously, Agwai [2008] has demonstrated the use of peridynamic models using EMU code. In this paper, a peridynamic-theory based drop and shock model has been developed via finite element code using truss elements [Macek 2007]. The method enables the implementation of peridynamic theory in a commercial finite-element platform. Model predictions of peridynamic-models have been validated with experimentation for leadfree solder alloys system. |
| Starting Page | 1 |
| Ending Page | 12 |
| File Size | 1621974 |
| Page Count | 12 |
| File Format | |
| ISBN | 9781424453429 |
| ISSN | 10879870 |
| e-ISBN | 9781424453436 |
| DOI | 10.1109/ITHERM.2010.5501274 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-02 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Finite element methods Electric shock Predictive models Circuit testing Lead Integral equations Electronics packaging Solids Vibrations Partial differential equations Explicit Finite-Elements Peridynamics Drop Impact Electronic package |
| Content Type | Text |
| Resource Type | Article |
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