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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jiang, N. Novak, J. |
| Copyright Year | 2010 |
| Description | Author affiliation: Applied Nanotech, Inc., 3006 Longhorn Blvd., Suite 107, Austin, TX 78758, USA (Jiang, N.; Novak, J.) |
| Abstract | In this study, we present a newly developed carbon aluminum thermal management composite material that has a CTE less than 7.5 ppm/K, thermal conductivity over 400 W/mK, and the thermal diffusivity is 2.5 – 3 times higher than that of Cu and Al. In addition, the composite material is lightweight, and can be easily machined. We also show anisotropy in thermal performance aligning along carbon matrix extrusion direction during manufacturing. Even though this composite material is anisotropic, its thermal conductivity normal to the extrusion direction is comparable with that of Al or Al alloys. Moreover, the electrically insulating composite plates can be obtained by bonding ceramic sheets on composite surface during the composite fabrication process without the use of foreign adhesives. |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 777574 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424453429 |
| ISSN | 10879870 |
| e-ISBN | 9781424453436 |
| DOI | 10.1109/ITHERM.2010.5501305 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-02 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal conductivity Thermal expansion Thermal management Composite materials Anisotropic magnetoresistance Manufacturing Aluminum alloys Dielectrics and electrical insulation Bonding Ceramics high thermal conductivity carbon based aluminum composite low CTE |
| Content Type | Text |
| Resource Type | Article |
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