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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Baris, O.T. Hongxiang Tian Sinha, S. |
| Copyright Year | 2010 |
| Description | Author affiliation: University of Illinois at Urbana-Champaign, Department of Mechanical Science and Engineering, 1206 W Green Street Mechanical Engineering Building, USA, 61801 (Baris, O.T.; Hongxiang Tian; Sinha, S.) |
| Abstract | Transient power dissipation profiles in handheld electronic devices alternate between high and low power states depending on usage. Capacitive thermal management based on phase change materials potentially offers a fan-less thermal management for such transient profiles. However, such capacitive management becomes feasible only if there is a significant enhancement in the enthalpy change per unit volume of the phase change material since existing bulk materials such as paraffin fall short of requirements. In this paper we propose novel nanostructured thin-film materials that can potentially exhibit significantly enhanced volumetric enthalpy change. Using fundamental thermodynamics of phase transition, we calculate the enhancement resulting from superheating in such thin film systems. We further describe the design of a microfabricated calorimeter to measure such enhancements. This work advances the state-of-art of phase change materials for capacitive cooling of handheld devices. |
| Starting Page | 1 |
| Ending Page | 7 |
| File Size | 400603 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781424453429 |
| ISSN | 10879870 |
| e-ISBN | 9781424453436 |
| DOI | 10.1109/ITHERM.2010.5501367 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-02 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal management Thermodynamics Calorimetry Nanostructured materials Phase change materials Thermal management of electronics Transistors Power dissipation Cooling Handheld computers |
| Content Type | Text |
| Resource Type | Article |
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