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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chauhan, A. Sammakia, B. Ghose, K. Refai-Ahmed, G. Agonafer, D. |
| Copyright Year | 2010 |
| Description | Author affiliation: U.T. Arlington, PO Box 6000, Binghamton NY 13905, USA (Agonafer, D.) || AMD, Inc., PO Box 6000, Binghamton NY 13905, USA (Refai-Ahmed, G.) || Binghamton University, PO Box 6000, NY 13905, USA (Chauhan, A.; Sammakia, B.; Ghose, K.) |
| Abstract | The placement and arrangement of the different components on a microprocessor chip is examined to mitigate the hot spots that may arise on the device during its operation. The power dissipation of the individual components on a microprocessor is spatially and temporally non-uniform, possibly resulting in high thermal gradients and, as a consequence, high thermal stresses. These hot spots arise because the power dissipated by some components accounts for a major fraction of the total power of the device. The device then develops large temperature gradients and localized hot spots. These hot spots can cause device failures and a loss in performance that results when the clock frequency slows with voltage scaling to cope with thermal emergencies. It can also lead to lower yield. |
| Starting Page | 1 |
| Ending Page | 11 |
| File Size | 856157 |
| Page Count | 11 |
| File Format | |
| ISBN | 9781424453429 |
| ISSN | 10879870 |
| e-ISBN | 9781424453436 |
| DOI | 10.1109/ITHERM.2010.5501357 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-02 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Microchannel Cooling Thermal stresses Design optimization Thermal management Microprocessor chips Power dissipation Temperature Performance loss Clocks microchannel heat sink microprocessor localized hot spots thermal stresses optimized design |
| Content Type | Text |
| Resource Type | Article |
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