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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hussain, S. Jaeger, R.C. Suhling, J.C. Roberts, J.C. Motalab, M.A. Chun-Hyung Cho |
| Copyright Year | 2010 |
| Description | Author affiliation: Department of Mechanical Engineering, 201 Ross Hall, Auburn University, AL, USA 36849 (Hussain, S.; Suhling, J.C.; Roberts, J.C.; Motalab, M.A.) || Department of Electrical-Electronic Engineering, College of Science and Technology, Hongik University, Chungcheongnam-Do, South Korea (Chun-Hyung Cho) || Department of Electrical and Computer Engineering, 200 Broun Hall, Auburn University, AL, USA 36849 (Jaeger, R.C.) |
| Abstract | Multi-element resistor rosettes on silicon are widely utilized to measure integrated circuit die stress in electronic packages and other applications. Past studies of many sources of error have led to rosette optimization and demonstrated that temperature-compensated stress extraction should be used whenever possible. In this work, we extend the error analysis to include the inherent uncertainty in the measured values of the sensor resistances and the temperature at time of the measurement. The stresses in an under-filled flip chip package are calculated using finite element simulation and utilized to evaluate the stress dependent sensitivities across the die surface. Monte Carlo simulation results confirm that temperature compensated rosette configurations should be utilized whenever possible. |
| Starting Page | 1 |
| Ending Page | 12 |
| File Size | 1184812 |
| Page Count | 12 |
| File Format | |
| ISBN | 9781424453429 |
| ISSN | 10879870 |
| e-ISBN | 9781424453436 |
| DOI | 10.1109/ITHERM.2010.5501287 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-02 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Error analysis Piezoresistance Stress Flip chip Semiconductor device measurement Temperature sensors Electronics packaging Integrated circuit packaging Integrated circuit measurements Electrical resistance measurement |
| Content Type | Text |
| Resource Type | Article |
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