NDLI: Metal-polymer interfaces

Content Provider	IEEE Xplore Digital Library
Author	Faupel, F. Strunskus, T. Kiene, M. Thrun, A. Bechtolsheim, C.V.
Copyright Year	1998
Description	Author affiliation: Dept. of Mater. Sci. & Eng., Kiel Univ., Germany (Faupel, F.)
Abstract	Summary form only given, as follows. The increasing application of polymers in microelectronics has aroused much interest in metal-polymer interfaces. In this talk it is reviewed how structure and formation of metal-polymer interfaces are controlled by the preparation process and the nature of the materials involved. Emphasis is put on noble metal deposition onto fully cured polyimides and polycarbonates. Valuable information originates from radiotracer measurements of metal diffusion at the interface, structural investigations by means of cross-sectional electron microscopy, and computer simulations on the interplay of atomic metal diffusion and aggregation. Moreover, X-ray photoemission spectroscopy has largely contributed to our present understanding of the interfacial chemistry and the early stages of interface formation. Reactive metals always form relatively sharp interfaces with polymers, although the initial growth of Cr on polyimide recently proved to be different from the layer by layer mode. Metals of lower reactivity, on the other hand, diffuse into polymers at elevated temperatures and have a very strong tendency to agglomerate. The extent of diffusion appears to be determined by the initial stage of the deposition process. Here sticking coefficients recently measured for metals on virgin polymer surfaces deviate markedly from unity. Diffusion into the polymer increases strongly at low deposition rates, where a large fraction of isolated metal atoms is able to diffuse into the polymer before being trapped by other atoms at or near the surface. No significant diffusion is expected from a continuous metal film as a consequence of the high cohesive energy of the metal. The model emerging from these observations allows us to predict the salient features of interface formation between metal and polymers in general and particularly with respect to the new low k polymers. The correlation between interfacial structure and adhesion is addressed.
File Size	50989
File Format	PDF
ISBN	0780343069
DOI	10.1109/ICSICT.1998.785854
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-10-23
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polymers Atomic measurements Atomic layer deposition Polyimides Microelectronics Inorganic materials Electron microscopy Computer simulation Photoelectricity Spectroscopy
Content Type	Text
Resource Type	Article

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