NDLI: Effects of Trace Element Ag on Oxidation Failure of Copper Lead Frame

Content Provider	IEEE Xplore Digital Library
Author	Jiaqing Xi Ming Li Anmin Hu Hong Shen Dali Mao
Copyright Year	2006
Description	Author affiliation: Sch. of Material Sci. & Eng., Shanghai Jiaotong Univ. (Jiaqing Xi; Ming Li; Anmin Hu; Hong Shen; Dali Mao)
Abstract	The effects of trace element Ag on oxidation failure of copper lead frame were studied. It was found that trace Ag on surface has great effect on the oxidation failure of copper alloy lead frame. In dry condition, trace Ag on the surface increase its resistance of peeling. However, under hygrothermal aging, trace Ag on surface decrease its resistance of peeling. The oxide thickness, morphology and elements compositions were examined to see which one is the key factor leaded to peel of the oxide film. As a results, it become evident that Ag has the ability to block the diffusion of copper atoms, and consequently hold back the oxidation of copper, but the adhesive strength between copper and its oxide layer has little relation with oxide thickness and more important influence come from internal compressive stress which have great relations with initial structure of the copper lead frame
Starting Page	1
Ending Page	5
File Size	4641834
Page Count	5
File Format	PDF
ISBN	1424406196
DOI	10.1109/ICEPT.2006.359828
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-08-26
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Oxidation Lead compounds Surface resistance Surface morphology Aging Adhesive strength Delamination Packaging Copper alloys Silver silver Copper lead frame oxidation delamination hygrothermal aging
Content Type	Text
Resource Type	Article

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