NDLI: Simulation Calculation of Mechanical Performance of Particle Filled Electronic Packaging Polymer

Content Provider	IEEE Xplore Digital Library
Author	Dayong Gui Juhua Mao Deyu Tian Jianhong Liu
Copyright Year	2006
Description	Author affiliation: Sch. of Mater. Sci. & Eng., Beijing Inst. of Technol. (Dayong Gui)
Abstract	Electronic packaging polymers filled with various solid additives such as silica, flame retardant, etc. have excessively been required for the use in advanced IC packages in recent years. It's necessary to predict the mechanical properties of these electronic packaging materials. On the basis of structural and mechanical characterization of particle filled epoxy materials, a new three-phase (dispersion phase, interface phase, and continuous phase) constitutive model and its simulation calculation are performed for the mechanical properties of the particle filled electronic packaging polymer in this study. In this paper, the interface chemical principle and three phase constitute model are combined, which improve the mechanical property's calculation and composition design method of electronic packaging polymer. With this model, the relationship between mechanical properties of the electronic packaging materials and modulus of matrix, solid particles content, particle size, gradation and thickness of the interface adhesive layer were constructed mathematically. This relationship and its derived patterns can be used in not only the prediction of the mechanical properties of electronic packaging materials but also the instruction of the composition design for particle filled electronic packaging materials
Starting Page	1
Ending Page	5
File Size	5061486
Page Count	5
File Format	PDF
ISBN	1424406196
DOI	10.1109/ICEPT.2006.359801
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-08-26
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Polymers Mechanical factors Solids Composite materials Additives Silicon compounds Flame retardants Integrated circuit packaging Chemicals simulation calculation electronic packaging polymer mechanical performance
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Non halogen/antimony flame retardant system for high end IC package

High Filled Epoxy Composites for Electronic Packaging Application

Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

Characterisation of mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive

Distribution of a minor solid constituent in a transfer molded e-pad leadframe package

Environmentally conscious IC molding compound without toxic flame-retardants

Development of environmentally friendly epoxy-resin compounds without toxic flame retardants and their application to electronic parts

Polymer/CNTs Composites for Electronic Packaging

Green packages-requirements, materials, results

Simulation Calculation of Mechanical Performance of Particle Filled Electronic Packaging Polymer

Similar Documents

Non halogen/antimony flame retardant system for high end IC package

High Filled Epoxy Composites for Electronic Packaging Application

Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

Characterisation of mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive

Distribution of a minor solid constituent in a transfer molded e-pad leadframe package

Environmentally conscious IC molding compound without toxic flame-retardants

Development of environmentally friendly epoxy-resin compounds without toxic flame retardants and their application to electronic parts

Polymer/CNTs Composites for Electronic Packaging

Green packages-requirements, materials, results

Simulation Calculation of Mechanical Performance of Particle Filled Electronic Packaging Polymer