NDLI: Bonding Packaging of a SP4T RF MEMS Switch

Content Provider	IEEE Xplore Digital Library
Author	Guangwei Hu Zewen Liu Yi Qiao Zhihao Hou Jian Cai Litian Liu Zhjian Li
Copyright Year	2006
Description	Author affiliation: Inst. of Microelectron., Tsinghua Univ., Beijing (Guangwei Hu; Zewen Liu; Yi Qiao; Zhihao Hou; Jian Cai; Litian Liu; Zhjian Li)
Abstract	A study on bonding packaging of a SP4T series RF MEMS switch with metal-to-metal contact is presented. The switch, with the total die size of 3580mum times 2740mum, consists of a coplanar waveguide (CPW), SiON dielectric bridge membranes and broadside actuation electrodes. In order to protect the movable structures from the mechanical damage as well as the particle contaminations, a high-resistivity silicon cap with a rectangular cavity of 50mum depth is designed, fabricated via etching in KOH solution at 80 degC, and bonded on top of the switch with epoxy resin. The results show the bonding between the cap and the switch support substrate is mechanically robust and the degradation of the isolation is in the range of 5%-10% in the frequency band from 1-10 GHz
Starting Page	1
Ending Page	4
File Size	4323141
Page Count	4
File Format	PDF
ISBN	1424406196
DOI	10.1109/ICEPT.2006.359869
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-08-26
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Packaging Radiofrequency microelectromechanical systems Switches Coplanar waveguides Contacts Dielectrics Bridge circuits Biomembranes Electrodes
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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