NDLI: RF Characteristic and Modeling of the RF MEMS Switch Packaging

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RF Characteristic and Modeling of the RF MEMS Switch Packaging

Content Provider	IEEE Xplore Digital Library
Author	Hanqin Wu Xiaoping Liao
Copyright Year	2006
Description	Author affiliation: Key Lab. of MEMS, Southeast Univ., Nanjing (Hanqin Wu; Xiaoping Liao)
Abstract	The RF characteristic of a RF MEMS switch with a package cap was studied in this paper based on simulation and analysis. Simulation was divided into two parts-the edge of the cap and the center of the cap, in order to observe the different effect level between the edge and the center of the cap on the switch. The thickness of the bonding layer and the depth of cavity were changed in simulations so as to detect the key factor which affects the effect level. We combined the simulation results with the microwave theory, calculated the changes of the switch impedance caused by the package cap. The simulated and calculated results were validated using the soft MicroWave Office
Starting Page	1
Ending Page	4
File Size	3196130
Page Count	4
File Format	PDF
ISBN	1424406196
DOI	10.1109/ICEPT.2006.359770
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-08-26
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Switches Radio frequency Radiofrequency microelectromechanical systems Coplanar waveguides Bonding Impedance Microswitches Electronics packaging Scattering parameters Microwave devices
Content Type	Text
Resource Type	Article

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